Description
3M 7100170668 – Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing. Rubber based adhesive provides fast, reliable bonding strength and removes cleanly. Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens. – Cat. No. 442KW
Specifications
Manufacturer
3M
Adhesive Type
Rubber
Component
Bonding
Component
Mounting & Transfer Tape
Sub Component
Bonding Tape
Backing (Carrier) Material
Polyester Film
Length (Imperial)
108 Yd
Width (Imperial)
34 In






